摘要
以玉米优势腐败菌黄曲霉为试验对象,采用低温等离子体技术对污染黄曲霉菌的玉米籽粒进行处理,研究不同等离子体处理功率、处理时间和真空度对黄曲霉杀菌效果的影响。结果表明,杀菌最佳工艺为:等离子体处理功率447W、等离子体处理时间160s、真空度80Pa;在此条件下,等离子体对黄曲霉的杀菌率为85.42%。
In this paper,the dominant corn spoilage bacteria Aspergillus flavus was used as the research object.The plasma technology was used to treat corn kernels contaminated with Aspergillus flavus.The effect of different plasma treatment power,treatment time and vacuum degree on the sterilization effect of the target bacteria was studied.The best process for sterilization was determined by surface experiments:the plasma treatment power was 447 W,the plasma treatment time was 160 s,the vacuum degree was 80 Pa,and the sterilization rate of Aspergillus flavus was 85.42%.Scanning electron microscopy results showed that the spores of Aspergillus flavus were destroyed and the mold spores died after plasma treatment.
作者
李帅
曾英男
LI Shuai(Jilin Agricultural Science and Technology University,Jilin 132101,China)
出处
《安徽农学通报》
2021年第7期98-100,130,共4页
Anhui Agricultural Science Bulletin
基金
吉林农业科技学院青年基金项目(吉农院合字第[20200005]号)
吉林农业科技学院重点学科项目(吉农院合字[2019]第XZ005号)。
关键词
黄曲霉
等离子体
杀菌
Aspergillus flavus
Plasma
Sterilization
