摘要
目前倒装芯片用陶瓷外壳的表面处理工艺以化学镀镍/浸金(ENIG)为主,而ENIG带来的黑盘现象使封装产品面临润湿不良和焊接强度不足等一系列问题。化学镀镍/化学镀钯/浸金(ENEPIG)是ENIG的一种改进方案,可有效避免黑盘现象。对分别采用ENIG和ENEPIG镀层的陶瓷外壳样品在外观、微观形貌以及焊接强度等方面进行了对比,采用ENEPIG镀层样品的表现优于采用ENIG镀层的样品。对采用ENEPIG镀层的外壳样品进行了芯片贴装,并进行了热冲击、温度循环等一系列试验,试验合格率100%,说明该方案可以满足器件级鉴定检验要求。验证结果表明,ENEPIG在高密度陶瓷封装领域具有良好的应用前景。
At present,electroless nickel/immersion gold(ENIG)is the main surface finish process for flip chip ceramic package,but the"black pad"caused by ENIG makes the packages facing series problems such as poor wetting and insufficient soldering strength.Electroless nickel/electroless palladium/immersion gold(ENEPIG)is an improved solution of ENIG,which can effectively avoid"black pad".Ceramic packages with ENIG and ENEPIG plating were compared in terms of appearance,micromorphology and soldering strength.It is found that the samples with ENEPIG plating perform better than the samples with ENIG plating.Chips were mounted on the packges with ENEPIG plating,and a series of tests such as thermal shock and temperature cycling were carried out.The test pass rate is 100%,which indicates that ENEPIG can meet the requirements of device level identification and inspection.The verification results show that ENEPIG has a good application prospect in the field of high density ceramic packaging.
作者
张崤君
李含
Zhang Xiaojun;Li Han(The 13th Research Institute,CETC,Shijiazhuang 050051,China)
出处
《半导体技术》
CAS
北大核心
2020年第6期484-488,共5页
Semiconductor Technology
