摘要
文章概要地评述了PCB表面涂覆层的发展过程,指出PCB表面涂覆层已走向具有"阻挡层"主导的年代。传统没有阻挡层的表面涂覆层会形成金属间互化物(IMC)或者扩散层等缺点,削弱连接盘的结合力而影响可靠性。采用有"阻挡层"结构可避免金属间形成互化物和互相扩散,可稳定或提高焊接的结合力。化学镀镍浸金存在着明显的缺点,将被具有致密结构的阻挡层的化学镀镍浸钯浸金或化学镀镍-钯合金所取代。
In this paper, the development of surface coating layer with PCB is discussed, and the surface coating of the barrier layer will take the leading position. Using ＂barrier layer＂ structure can avoid the formation of the metal forming cross （IMC） and the diffusion of each other, and can stay stable or increasing the strength of the welding. ENIG has obvious shortcomings, and it will be replaced by ENEPIG or ENEP with the barrier layer.
出处
《印制电路信息》
2015年第10期54-58,共5页
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