摘要
为研究微焊点中金属间化合物(IMC)比例不断增加对其热疲劳可靠性的影响,构建了细间距倒装芯片组装的有限元模型,探讨热循环条件下微焊点的累积损伤与疲劳寿命;采用Darveaux疲劳寿命预测模型建立损伤尺度与热循环次数间的关系,定量计算不同IMC厚度下微焊点的疲劳寿命。结果表明,在稳定热循环条件下,随着微焊点中IMC厚度的增加,微焊点的累积塑性应变能密度增量增大,疲劳寿命降低;当IMC在微焊点中所占比例达到80%时,微焊点的疲劳寿命降低约25%,但IMC厚度的增加对微焊点疲劳裂纹的萌生位置几乎没有影响。
To investigate the effect of increasing proportion of intermetallic compounds(IMC)in the micro-joint on its thermal fatigue reliability,the finite element model for a fine pitch flip chip assembly was constructed in this paper,which was used to discuss the cumulative damage and fatigue life of the micro-joint during thermal cycling conditions.Based on Darveaux fatigue life prediction model,the relationship between damage scale and thermal cycles was established,and the fatigue life of micro-joints with different IMC thickness was calculated.The results showed that with the increase of IMC thickness in the micro-solder,the cumulative plastic strain energy density increased and the fatigue life decreased.When the IMC reached 80% of the micro-joint,the fatigue life would be reduced by about 25%.However,the increase of IMC thickness had little effect on the initiation position of fatigue crack of micro-joint.
出处
《焊接技术》
2018年第10期26-30,共5页
Welding Technology
基金
国家自然科学基金(U1504507)
河南省科技厅国际合作项目(172102410025)
