摘要
针对过压保护器在塑封成型过程中的金线偏移现象,分析了金线偏移产生的原因,设计了合理的注塑方案,以金线偏移量最小为标准,运用Moldflow软件的微芯片封装模块对其进行工艺参数的数值模拟,结合正交试验选取最优工艺参数组合,得到最小金线偏移量,并通过高倍X射线透视装置进行生产验证。生产验证表明:通过正交实验优化后得出的金线偏移量0.0400 mm,与该优化工艺参数组合下的实际产品最小金线偏移量结果一致,降低了过压保护器的金线偏移量,提升了产品质量。
Aiming at the phenomenon of gold wire sweep in the process of plastic package of theoverpressure protector, the causes of gold wire sweep were analyzed and a reasonable injection plan wasdesigned. The minimum deviation of gold wire was taken as the standard, the microchip packaging module ofMoldflow was applied to simulate the process parameters, and combined with orthogonal test, the best processparameter combination was selected to get the minimum gold wire offset. The production was verified by highpower X ray fluoroscopy device. Production validation shows that the gold line offset is 0. 040 0 mm afteroptimization, consistent with the minimum gold wire offset of the actual product under the optimized processparameters, which reduces the offset of the gold wire of the overvoltage protector and improves the productquality.
作者
梅益
朱春兰
刘闯
杨秀伦
孙全龙
张国浩
MEI Yi, ZHU Chun-lan1 , LIU Chuang1 , YANG Xiu-lun2 , SUN Quan-long1 , ZHANG Guo-hao1(1. School of Mechanical Engineering, Guizhou University, Guiyang 550025, China; 2. Yongguang Electronics Ltd. , China Zhenhua Group, Guiyang 550018, Chin)
出处
《塑料工业》
CAS
CSCD
北大核心
2018年第3期51-54,共4页
China Plastics Industry
关键词
塑封成型
金线偏移
正交试验
X射线透视装置
Plastic Molding
Gold Wire Sweep
Orthogonal Experiment
X-ray Fluoroscopy Device
