摘要
为分析封装材料及模塑过程参数对塑封IC翘曲的影响,本文先介绍塑料四边引线扁平封装(PQFP)使用的环氧模塑化合物(EMC)的热特性。并对不同模塑样品的聚合程度(DOC)、热膨胀系数(CTE)、玻璃转变温度Tg、剪切模量G等,运用各种热分析技术进行测量。结合不同封装过程参数,运用三维有限元分析法进行封装翘曲预测。最后对塑料四边引线扁平封装(PQFP)IC翘曲的测量值与预测值进行比较。
To analyse the encapsulant and molding process conditions' influences on warpage of plastic IC; Packages, this article first introduced the thermal characterization of epoxy molding compound used by PQFP Degree-of-cure(DOC)、coefficient of thermal expansion(CTE)、glass transition temperature Tg and shear modulus G of the molded spacimens were measured by various thermal analysis techniques. Package warpage predictions againest different processing conditions were performed via finite element analyses (FEA).At last,compared the measured data with prediction for the warpage of PQFP IC.
出处
《电子与封装》
2003年第4期24-27,共4页
Electronics & Packaging
关键词
环氧模塑化合物
聚合程度
热膨胀系数
玻璃转变温度
剪切模量
翘曲预测
翘曲测量
Epoxy molding compound (EMC)
Degree-of-cure(DOC)
Coefficient of thermal expansion (CTE)
Glass transition temperature Tg
Shear modulus
Finite element analyses (FEA)
Warpage prediction ￡>>Warpage measurement.
