摘要
研究了IC塑封浇注系统对金线偏移的影响,通过数值模拟对金线偏移现象进行理论分析与预测,以金线偏移量最小为标准,对浇口参数进行优化。在模拟优化的基础上设计制造了不同浇口参数的模具镶件,对模拟结果进行实际验证。实验中采用X射线检测技术,提出了一种新的对金线偏移程度观测的方法。结果表明:型腔压力随浇口厚度H的增加而变小,入射角α的变化对压力的影响相对较小;厚度为0.25 mm,入射角为50°的浇口尺寸为最优;浇口厚度为0.25 mm,入射角为50°时的金线实际偏移量平均值为0.049 mm,金线偏移程度最小;浇口厚度为0.25 mm,入射角为30°时,金线实际偏移平均值为0.072 mm,金线偏移程度最大。
The influence of the gating system with the IC package on the golden wire sweep during molding was studied. The theory analysis and prediction of the golden wire sweep were carried out by the numerical simulation. And the parameters of the mold gate were optimized with the minimum offset of the golden wire as the standard. Inserts with different parameters of the mold gate were designed and manufactured on the basis of the simulation optimization,and were used to verify the simulation results. A new observation method of the golden wire sweep degree was proposed with the X-ray detection technology in the experiment. The results show that the pressure of the cavity decreases with the increase of the thickness of the mold gate（ H）,and the change of the incidence angle（ α） has a slightly influence on the stress. The thickness of 0. 25 mm and incidence angle of 50° for the optimized mold gate size is obtained. When the mold gate thickness is 0. 25 mm and the incident angle is 50°,the average of the actual wire sweep is 0. 049 mm,and the golden wire sweep degree is minimum. When the mold gate thickness is 0. 25 mm and the incident angle is 30°,the average of the actual wire sweep is 0. 072 mm and the golden wire sweep degree is maximum.
出处
《半导体技术》
CAS
CSCD
北大核心
2014年第7期527-531,共5页
Semiconductor Technology
基金
国家自然基金资助项目(51075256)
上海工程技术大学研究生科研创新资助项目(14KY0522)
关键词
IC封装
金线偏移
浇口参数
数值模拟
观测方法
IC package
golden wire sweep
mold gate parameter
numerical simulation
observation method
