摘要
以含有20～35 g/L氰化亚金钾和80 g/L磷酸盐的电铸金溶液为基础,在p H 6.5～6.8、温度40°C、电流密度0.4 A/dm2和电镀时间12 h的条件下,对比研究了分别采用氨基羧酸盐体系添加剂和有机多膦酸盐体系添加剂时所得铸金层的表面形貌、纯度、显微硬度和电流效率。结果表明,采用有机多膦酸盐添加剂时,阴极电流效率为92.01%,比采用氨基羧酸盐体系添加剂时高19.99个百分点,所得3D硬足金产品外观均一,结晶细致,显微硬度为97 HV,纯度为100%。
Gold electroforming was carried out under the conditions of pH 6.5-6.8, temperature 40 °C, current density 0.4 A/dm2 for 12 hours from a basic bath containing 20-35 g/L potassium gold cyanide and 80 g/L phosphate. The surface morphology, purity, and microhardness of gold coating as well as current efficiency when using polyphosphonate and amino carboxylate respectively as additive were comparatively studied. The cathodic current efficiency is 95.01% when using polyphosphonate additive, 19.99 percentage points higher than that achieved when using amino carboxylate additive. The electroformed 3D hard gold product features a uniform appearance, fine and compact crystallization, a microhardness of 97 HV and a purity of 100%.
出处
《电镀与涂饰》
CAS
CSCD
北大核心
2018年第1期1-4,共4页
Electroplating & Finishing
关键词
硬足金
电铸
多聚膦酸盐
氨基羧酸盐
表面形貌
显微硬度
纯度
电流效率
hard pure gold
electroforming
polyphosphonate
amino carboxylate
surface morphology
microhardness
purity
current efficiency
