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电铸技术的发展及应用 被引量:28

Developments and Applications of Electrodeposition
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摘要 通过阐述电铸的基本原理,分析了电源、电解液和阳极材料等电铸要素对电铸技术发展的影响,并结合电铸的自身优点介绍了电铸技术的应用情况,在正确面对并处理好电铸技术存在的不足的情况下,电铸作为一门交叉学科的技术仍具有广阔的发展空间和应用前景。 Developing with the electrodeposition, it is used in production more and more. The principle of the electrodeposition was expatiated firstly, then the elements were analyzed which includes power supply, electrolyte, and materials of anode. Combined with the excellence of the electrodeposition, some applications of electrodeposition were introduced. If the shortcomings of the electrodeposition are faced correctly, the electrodeposition, as a cross subject, will possess wide develop-- ment and application.
出处 《电加工与模具》 2006年第5期1-6,共6页 Electromachining & Mould
关键词 电铸 脉冲电源 精密加工 快速成形 electrodeposition pulses power supply precise machining rapid prototyping
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参考文献20

  • 1杨绮琴 ... ..应用电化学[M],2001.
  • 2Tajiri K, et al. Development of an electroformed copper lining for accelerator components[J ]. Electrochemical Acta, 2001,47 : 143- 148. 被引量:1
  • 3Lee M H, Pimpl M. Development of a new electrodepo-sition method for Pu-determination in environmental samples [J ]. Applied Radiation and Isotopes, 1999,50 : 851 - 857. 被引量:1
  • 4Ghaemia M, Binder L. Effects of direct and pulse current on electrodeposition of manganese dioxide[J]. Journal of Power Sources,2002 , 111:248 - 254. 被引量:1
  • 5Chan K C, et al. Effect of reverse pulse current on the internal stress of eleetroformed nickel[J]. Journal of Materials Processing Technology, 1997,63:819- 822. 被引量:1
  • 6Masanori Kunieda, et al. Rapid prototying by selective electrodeposition using electrolyte Jet[J]. Annals of the CIRP, 1999, 47(1):161- 164. 被引量:1
  • 7Karakus C, Chin D T. Metal distribution in jet plating[J]. J.Electrochem. Soc, 1994, 141(3):691-697. 被引量:1
  • 8熊毅,荆天辅,张春江,邵光杰,于升学,张芳,张春玲.喷射电沉积纳米晶镍的研究[J].电镀与精饰,2000,22(5):1-4. 被引量:47
  • 9李健心.精密电铸成形技术及应用[J].航空制造技术,2002,45(1):59-60. 被引量:1
  • 10Ra'a A. Said. Adaptive tip-withdrawal control for reliable microfabrication by localized electrodeposition [ J ]. Journal of Microelectromechanical Systems, 2004, 13(5) : 822 - 832. 被引量:1

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