摘要
基板散热是LED散热的最主要途径,其散热能力直接影响到LED器件的性能和可靠性。总结了LED封装基板材料的性能,综述了金属基板、陶瓷基板、硅基板和新型复合材料基板的研究进展,展望了功率型LED封装基板的应用和发展趋势。综合表明,MCPCB,DBC,DAB,DPC等基板各具优势,但DPC基板各种制备工艺参数合适,特别是铝碳化硅基板(Al/Si C)有着低原料成本、高导热、低密度和良好可塑性的显著优势,有望大面积推广应用。
Substrates is the most important way for cooling LED. Its cooling capacity affects performance and reliability of LED devices directly. In this work, properties of LED packaging substrate materials were summarized, and metal substrates, ceramic substrates, silicon substrates as well as the novel composite substrates were reviewed. Moreover, application and development trend of power LED packaging substrate were prospected. The results showed that MCPCB, DBC, DAB, DPC and other substrates have their own advantages, but the preparation process of DPC is appropriate. In particular, aluminum silicon carbide substrate （Al/SiC） has the significant advantages of a low cost of raw materials, high thermal conductivity, low density and good plasticity, which is expected to be widely used as substrates in LED.
出处
《精密成形工程》
2018年第1期132-141,共10页
Journal of Netshape Forming Engineering
基金
中国博士后科学基金(2015M582221)
广东省科技项目(2013B090600031)
关键词
功率LED
封装基板
散热
制备
power LED
packaging substrate
heat dissipation
preparation
