摘要
基于Patran软件建立了叠层焊点三维有限元分析模型,分析了随机振动条件下叠层焊点的固有频率、振型和频率响应规律,获得了叠层焊点应力应变分布和应变功率谱密度响应曲线,并基于功率谱和雨流计数法计算出了叠层焊点振动疲劳寿命;分析了焊盘直径和焊点最大径向直径对叠层焊点随机振动寿命影响。仿真结果表明:在叠层焊点高0.5 mm、焊盘直径0.3 mm和焊点径向最大直径0.4 mm时其随机振动疲劳寿命为3 132 h;当焊盘直径从0.2 mm增加到0.35 mm时,叠层焊点振动疲劳寿命随焊盘直径增大而增大;当焊点最大径向直径从0.4 mm增加到0.55 mm时,叠层焊点振动疲劳寿命随焊点最大径向直径增大而减少。
Based on Patran software, the 3D finite element models of double-bump solder joints were set up. The natural frequency, vibration mode and frequency response rule of the models were analyzed under random vibration. The stress and strain distribution and the response curves of strain power spectrum density for the double-bump solder joints were obtained, and then the random vibration fatigue life of the double-bump solder joints were also calculated out based on the power spectrum and rain flow count method. The effect of the pad diameter and the maximum radial diameter for double-bump solder joints on the fatigue life of the double-bump solder joints were analyzed under random vibration. The results obtained from the simulation show that the double-bump solder joint with the height of 0. 5 mm, the pad diameter of 0. 3 mm and the maximum radial diameter of 0. 4 mm has the fatigue life of 3 132 h under random vibration. When the pad diameter increases from 0. 2 mm to 0. 35 mm, the fatigue life of double-bump solder joints increases with the pad diameter. When the maximum radial diameter of solder joints increases from 0. 4 mm to 0. 55 mm, the fatigue life of double-bump solder joints decreases with the maximum radial diameter.
出处
《振动与冲击》
EI
CSCD
北大核心
2017年第16期202-206,共5页
Journal of Vibration and Shock
基金
国家自然科学基金资助项目(51465012)
广西壮族自治区自然科学基金资助项目(2015GXNSFCA139006)
关键词
随机振动
叠层焊点
功率谱
疲劳寿命
有限元分析
random vibration
double-bump solder joint
power spectrum
fatigue life
finite element analysis
