摘要
本文利用电动振动台模拟振动环境,以某型号电子产品为试验对象,选取该10台(套)产品单板与整机带减震器进行500h低频振动,分析电子产品在低频振动环境中心的电子产品的破坏模式。再以该产品为试验对象拆除减震器进行中频振动,阐述电子产品在中频振动环境中的损伤规律。研究试验表明,低频振动对电子产品的几乎没有损伤,在中频振动环境中的受到主要的破坏机理是疲劳损伤。共振频率、噪声干扰和谐振峰值是中、低频振动对电子产品损伤主要因素,基于中低频振动环境计算出了电子产品的失效率,发现单板振动量级放大,并修正失效模型。
This paper uses an electric vibration platform to simulate vibration environment,taking a certain type of electronic product as test object,selecting the 10(set)products single board and the whole machine with shock absorber for 500 hours low frequency vibration,and analyzing the failure mode of electronic products in the center of low frequency vibration environment.Then this product is taken as the test object to remove the shock absorber for intermediate frequency vibration,and the damage rule of electronic products in medium frequency vibration environment is expounded.Experiments show that low frequency vibration has almost no damage to electronic products,and main damage mechanism in medium frequency vibration environment is fatigue damage.Resonance frequency,noise interference and harmonic peak are main damage factors of electronic products with medium and low frequency vibration.Based on medium and low frequency vibration environment,the failure rate of electronic products is calculated,and the magnitude of the vibration magnitude of the single board is found and the failure model is corrected.
作者
齐亚欣
陈嵩
王志才
刘卫兵
姜晖
QI Ya-xin;CHEN Song;WANG Zhi-cai;LIU Wei-bing;JIANG hui(Beijing Aerospace GuangHua Electronics Technologies Limited Corporation,Beijing 100854)
出处
《环境技术》
2018年第5期46-51,共6页
Environmental Technology
关键词
中、低频振动
电子产品
疲劳损伤
谐振峰
medium and low frequency vibration
electronic product
fatigue damage
harmonic peak
