摘要
对PBGA封装体建立了有限元数值模拟分析模型。模型采用无铅焊点,完全焊点阵列形式。研究了封装体在经历IPC9701标准下的五种不同温度循环加载后,受到的热应力、应变,以及可能的失效形式。结果表明,焊点是封装体结构失效的关键环节,焊点所受应力大小与焊点位置有关。比较了不同温度循环下封装体的疲劳寿命。其结果为提高封装体的可靠性和优化设计提供了理论依据。
The finite element numerical simulation model was established for a plastic ball grid array （PBGA） subjected to thermal cycling loading. In models the finite element analysis of full-matrix PBGA solder joint was studied. Thermal stress and strain of the package and possible invalidation of the package in five different thermal cycle loadings of IPC9701 standard were simulated and analyzed. The results show that solder joints are the most dangerous points of package structure failure, the stress of solder joint is connected with its location. The fatigue life of five different thermal cycling loadings was compared. The numerical analyses provide data-base for improving reliability of package and optimum design.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2008年第1期65-68,共4页
Electronic Components And Materials
基金
国家自然科学基金资助项目(50376076)
