摘要
使用有限元软件MSC.Marc分析了芯片粘结剂的形态、厚度和宽度对典型微电子封装QFN(四方扁平无引脚封装)器件热应力的影响。结果表明:在有限元网格密度相同的条件下,粘结剂形态的不同会对QFN器件的热应力产生较大影响,粘结剂无溢出形态的最大热应力为85.87MPa,而粘结剂有溢出形态的最大热应力为77.84MPa,并且最大热应力出现的位置也不同;粘结剂的厚度和宽度对热应力的影响不明显;由于粘结剂形态的不同界面热应力的分布会有较大差别。
The finite element software MSC.Marc was employed to investigate the influence of the adhesive fillet shapes and dimension parameters on the thermal stress of microelectronics packaging QFN device.The results show that in the case of same finite element mesh density,the adhesive fillet shape has significant influence on the thermal stress of QFN devices.The maximum thermal stress of QFN device is 85.87 MPa without adhesive overflow fillet,while the thermal stress decreases to 77.84 MPa with adhesive overflow fillet.And the location of maximum thermal stress is different with different adhesive fillet shape.The thickness and width of the adhesive have little effect on the thermal stress.The distribution of interfacial thermal stress has a great difference with different adhesive fillet shapes.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第3期76-78,共3页
Electronic Components And Materials
基金
国家自然科学基金资助项目(No60666002)
