摘要
运用有限元数值分析法对三种PCB散热结构，分别是芯片下方的PCB中埋置铜块（PCB-Ⅱ型）、PCB底部压合铜板（PCB-Ⅲ型）、PCB中间加入导热铝层（PCB-Ⅳ型）进行稳态、瞬态热分析、热阻分析以及不同对流系数下的热分析，并与不经过散热处理的PCB参照组（PCB-Ⅰ型）进行对比。结果显示：在稳态和瞬态热分析中，Ⅱ型、Ⅲ型、Ⅳ型较参照组PCB-Ⅰ型板面最高温度分别降低了3．22，9．66，7．86℃，其中Ⅲ型升温幅度最平缓，Ⅱ型与Ⅲ型在10～30s温度差距小，在30s后逐渐拉大；在改变对流系数时，Ⅲ型散热效果最好，而Ⅱ型随着对流系数增加散热效果趋近于Ⅳ型。
Three structures of PCB heat dissipations including the embedment of copper block under the chip （PCB-Ⅱ）, conjunction of the copper plate on the bottom （PCB-Ⅲ） and the addition of Al plate （PCB-Ⅳ） were carried out FEM numerical analysis, including steady-state analysis, transient thermal analysis, heat resistance analysis and thermal analysis under different air heat convection coefficients, and compared to the common PCB（PCB-Ⅰ）without effective heat treatment. The results indicate that PCB with three kinds of heat dissipation structures as PCB-Ⅱ, PCB-Ⅲ and PCB-Ⅳ successfully reduce maximum temperatures by 3.22, 9.66, 7.86 ℃ compared to the reference group PCB-Ⅰ in the steady-state and transient thermal analyses. The temperature variation of PCB-Ⅲ structure is the flattest among four kinds of PCB structures The temperature gap between PCB-Ⅱ and PCB-Ⅲ is little within 10 s to 30 s and widen after 30 s. Heat dissipation effect of PCB-Ⅲ is the best after the variation of convection coefficients, while the thermal dissipation effect of PCB-Ⅱ tends to PCB-Ⅳ with the convection coefficient increase.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2014年第1期43-47,共5页
Electronic Components And Materials
基金
2012年广东省教育部产学研结合重大专项资助项目(No.2012A09030007)
关键词
PCB
散热
埋入式
导热系数
有限元分析
对流系数
PCB
thermal dissipation
embed
thermal conductivity
FEM analysis
convection coefficient
