摘要
以二苯基硅二醇为环氧树脂E-51的改性剂,运用非等温DSC法对改性前后的E-51进行了固化动力学研究。采用Kissinger和Crane方程分别计算得到改性前后固化反应活化能E、指前因子A和反应级数n,利用外推法确定了E-51的固化工艺,并对改性前后E-51固化物进行了DSC、力学性能、热失重(TG)和SEM的测试。结果表明,有机硅改性对E-51的固化有促进作用;降低了改性E-51固化物的玻璃化温度(Tg),提高了力学性能和耐热性,且对E-51有增韧作用。
In this paper, the silicone modified epoxy resin was prepared from dihydroxydiphenylsilane and epoxy resin（E-51）. The curing kinetics of unmodified and modified epoxy resins was investigated by non-isothermal dift＇erential scanning calorimeter （DSC） method. The activation energy E, pre-exponential factor A and reaction order n of the curing reactions were obtained by Crane equation and Kissinger equation. The curing process of epoxy resin was calculated by extrapolation method, and the cured products of unmodified and modified E-51 epoxy resins were characterized by DSC, mechanical propertyies measurements, thermogravimetic （TG） analysis and scanning electron microscopy （SEM）. The results showed that the silicone-modification promoted the curing process orE-51 epoxy resin, slightly decreased the glass transition temperature（Tg） of the cured products, and increased the mechanical properties, thermal stability and toughness of the cured products.
出处
《粘接》
CAS
2016年第11期43-48,共6页
Adhesion
关键词
环氧树脂
有机硅
改性
固化动力学
epoxy resin
silicone
modification
curing kinetics
