摘要
在同种树脂体系及相同银粉含量下,加入不同比例的亚微米银粉,通过体积电阻率、接触电阻、剪切强度等测试,探究亚微米银粉对导电银胶性能的影响。
Under the same resin system and the same content of silver, the bulk resistivity, contact resistance and shear strength of the electronic conductive silver pastewas investigatedusing thedifferent proportions of submicron silver powder, the effect of submieron silver powder on the properties of conductive silver paste were discussed.
出处
《山东化工》
CAS
2015年第15期50-51,53,共3页
Shandong Chemical Industry
关键词
导电银胶
亚微米银粉
体积电阻率
接触电阻
剪切强度
conductive silver paste
submieron silver powder
bulk resistivity
contact resistance
shear strength
