期刊文献+

有机硅改性环氧树脂耐热胶粘剂的研制 被引量:24

Study on Organosilicon Modified Epoxy Resin Adhesive for Heat-resistance
下载PDF
导出
摘要 用有机硅活性中间体对环氧树脂E44进行接枝共聚改性,得到一种具有良好耐热性和机械性能的新型改性树脂,研究了催化剂种类、原料配比、反应温度和时间对产物的影响。以自制芳香胺为固化剂,添加一定量的纳米TiO2和丁腈橡胶,制得的胶粘剂在30℃、7天基本固化完全,250℃热老化100h后,仍有15.3MPa的剪切强度。并用FT-IR、DSC、TGA等手段对产物进行了表征和分析。 A heat-resistant modified epoxy resin with good mechanical properties is prepared by condensation polymerization of epoxy resin (FA4) and silicone intermediate. The influences of catalyst, stoichiometric composition, reaction temperature and time on the properties of production are investigated. The adhesive prepared by use of synthesized curing agent, modified epoxy resins as adhesive system and adding nano-TiO2 and butadiene nitrile rubber, can be cured at 30℃ in 7 days. Its shearing strength could reach 15. 3MPa after 250℃/100 h heat-aging. The modified resin is analyzed and characterized by means of FT-IR, DSC and TGA.
出处 《材料导报》 EI CAS CSCD 北大核心 2006年第F05期54-56,共3页 Materials Reports
基金 武器装备预研基金项目(5141001020DZ02)
关键词 环氧树脂 有机硅 耐热 胶粘剂 epoxy resin, organosilicon, heat-resistance, adhesive
  • 相关文献

参考文献7

  • 1蔡辉,闫逢元,薛群基.环氧树脂研究与应用进展[J].材料导报,2003,17(2):46-48. 被引量:13
  • 2Shyue, et al. Thermal degradation study of siloxane-DGEBA epoxy copolymers [J]. Eur Polym J, 1997, (33):3. 被引量:1
  • 3Ananda Kumar S, Sankara T S N. Ther-mal properties of siliconized epoxy interpenetrating coating [J]. Progress Inorganic Coating, 2002, (45): 323 被引量:1
  • 4伍越寰编..有机结构分析[M].合肥:中国科学技术大学出版社,1993:294.
  • 5Devroey D R N, Homma M. Blendsof sily-terminated polyetherand epoxides as elastic adhesives [J]. Int J Adhesion Adhesives, 2001, (21) : 275 被引量:1
  • 6周建文.单组分环氧树脂胶粘剂的研究现状[J].化学与粘合,2004,26(1):36-40. 被引量:31
  • 7Christine Naito, Michael Todd. The effects of curing parameters on the properties development of an epoxy encapsulant material [J]. Microelectronics Reliability, 2002,(42):119 被引量:1

二级参考文献25

共引文献40

同被引文献608

引证文献24

二级引证文献156

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部