摘要
将真空压铸(50%真空度)Al-Si-Cu合金试样在500℃固溶处理0.5、2、4和6 h以及进行500℃×4 h+530℃×6 h的固溶处理,利用光学显微镜和扫描电镜研究了真空压铸对Al-Si-Cu合金固溶处理过程表面起泡的影响。结果表明:相对于普通压铸,真空压铸试样基体更致密、内部气孔小且分散,固溶处理过程中起泡核心长大需要较长时间,表面起泡小于100μm的条件下,在500℃可固溶处理2 h;起泡核心距离表面越远、核心尺寸越小以及表面致密度、强度越高,表面起泡所需要的时间也越长。
The vacuum high pressure die casting （HPDC） A1-Si-Cu samples were processed with solution treatment at 500 ℃for 0.5, 2, 4 or 6 h, and at 500 ℃ for 4 h followed by 530 ℃ for 6 h, then the effects of vacuum die casting on surface blisters of the samples which emerge during heat treatment were studied with OM and SEM. The results show that compare to ordinary casting samples, vacuum HPDC samples yield a more dense matrix, as well as a smaller and more dispersed internal porosities, herein, more time is required for surface blisters of vacuum HPDC samples grow up, specifically, vacuum HPDC samples can be treated at 500 ℃ for 2 h with blisters less than 100 μm. Besides, a surface blister tends to occur later, when the distance between blister core and the surface is longer, its size is smaller, and it is in a higher density and strength matrix structure.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2016年第2期20-24,共5页
Transactions of Materials and Heat Treatment
基金
中央高校基本科研业务费(CDJZR12130050)
关键词
真空压铸
表面起泡
固溶处理
AL-SI-CU合金
气孔
vacuum high pressure die casting（HPI）C）
surface blister
solution treatment
A1-Si-Cu alloy
pore
