摘要
采用自制Sn-3.0Ag-0.5Cu-3.0Bi合金对Si CP/6063Al复合材料进行真空钎焊。通过SEM、EDX实验方法分析钎料与化学镀镍后Si CP/6063Al复合材料真空钎焊接头的显微组织。结果表明:无铅钎料Sn-3.0Ag-0.5Cu-3.0Bi合金显微组织主要由富Sn相、共晶组织和单质Bi构成;其显微组织形成机制可以用化学亲和力来表征,元素间的化学亲和力参数越大,越容易形成化合物;Si Cp/6063Al复合材料真空钎焊后的焊缝组织致密,钎料对镀镍复合材料的润湿性良好;界面生成的IMC为(CuxNi1-x)6Sn5,其晶体结构与Cu6Sn5相似,只是部分Cu原子被Ni取代。
Si Cp/6063 Al composites were soldered by using Sn-3.0Ag-0.5Cu-3.0Bi solder in vacuum. The microstructure of the solder and the vacuum soldered joint of the Si Cp/6063 Al composite after electroless nickel plating were studied by means of SEM and EDX. The results show that Sn-3.0Ag-0.5Cu-3.0Bi alloy mainly consists of Sn-riched phase,eutectic structure and elemental Bi. The chemical affinity can be used to characterize the microstructure formation mechanism of Sn- 3.0Ag-0.5Cu-3.0Bi alloy. The higher the chemical affinity parameters between elements,the easier the compounds form. The microstructure of soldered seam is quite compact since the lead-free solder has a good wettability with nickel plated composite. The IMC at the interface is(CuxNi1- x)6Sn5,and its crystal structure is similar to Cu6Sn5,except that part of Cu is substituted by Ni.
出处
《兵器材料科学与工程》
CAS
CSCD
北大核心
2016年第5期36-39,共4页
Ordnance Material Science and Engineering
基金
河南省教育厅科学技术研究重点项目(13A430326)
河南省科技攻关项目(142102210434)
河南省高等学校矿业工程材料重点学科开放实验室开放课题(MEM14-18)
河南理工大学青年基金(Q2012-25A)
河南理工大学博士基金(B2009-74)
