摘要
采用Sn3.0Ag0.5Cu3.0Bi软钎料对镀镍后的两种不同体积比SiC_p/6063Al复合材料进行真空钎焊。通过SEM、剪切试验等方法分析了化学镀镍后SiC_p/6063Al复合材料真空钎焊接头的显微组织以及保温时间对接头性能的影响。结果表明:两种不同体积比SiC_p/6063Al复合材料真空钎焊后的焊缝组织致密,钎料对镀镍复合材料的润湿性良好;在270℃、保温35min的钎焊工艺下,钎焊接头的剪切强度最大值为38.3 MPa;钎料中的Sn、Cu元素能够与复合材料表面的Ni层发生化学反应,实现钎料与母材的冶金结合;镀镍后SiC_p/6063Al复合材料真空钎焊接头断裂形式为韧性断裂为主的混合断裂,断裂主要发生在钎料内部,部分发生在镀镍层与钎料的结合处。
SiCp/6063 Al composite containing high and low volume fraction SiC after electroless nickel plating were soldered by using Sn3.0Ag0.5Cu3.0Bi solder in vacuum.The vacuum soldered joint microstructure between SiCp/6063 Al composite after electroless nickel plating and the effect of holding time on the property of joint were studied by means of SEM and shearing test.The results showed that the microstructure of soldering seam was quite compact since the lead-free solder could wet SiCp/6063 Al composite after electroless nickel plating very well.The shear strength of the soldered joint reached to maximum of 38.3 MPa under soldering temperature of 270 ℃ and holding time for 35 min.The element Sn and Cu from the solder reacted with Ni on the SiCp/6063 Al composite,resulting in a metallurgical bonding between the solder and base material.The fracture mode of soldered joint of the SiCp/6063 Al composite after electroless nickel plating was mixed ductile mainly of ductile fracture.Fracture occurred in the solder mostly and occurred around the IMC layer rarely.
出处
《材料导报》
EI
CAS
CSCD
北大核心
2016年第4期98-101,共4页
Materials Reports
基金
河南省教育厅科学技术研究重点项目(13A430326)
河南省科技攻关项目(142102210434)
河南省高等学校矿业工程材料重点学科开放实验室开放课题(MEM14-18)
河南理工大学青年基金(Q2012-25A)
河南理工大学博士基金(B2009-74)
