摘要
采用在高体分碳化硅增强铝基复合材料表面化学沉积Ni P合金镀层的方法来改善焊接性能。本文用特殊的前处理工艺 ,在复合材料表面形成结合牢固、光亮、致密、均匀、连续的Ni P合金镀层 ,并观察了镀层形貌和镀覆过程的差异。将不含贵金属钯的活化液应用于该复合材料的活化过程 ,不仅成功地化学沉积上良好的镍磷镀层 ,而且能够大大降低成本。采用X射线衍射、扫描电子显微镜、能谱对基体材料和镀层的结构、表面和截面的微观状态、元素组成进行了测试。结果表明 :在酸性镀液中获得的镀层是微晶结构 ,属于中磷镀层 ;在碱性镀液中获得的镀层是晶态的 ,属于低磷镀层。
The solderability of SiC p/Al composite materials is improved by electroless Ni-P alloy plating on its surface. Owing to special pretreatments, a tight bonded, bright, compact, uniform and continuous Ni-P coating is formed on the surface of the composite materials. The differences of coating morphology and depositing process are investigated. The application of activating solution without noble metal Pd to activation of the composite materials can not only obtain a good electroless Ni-P coating but also greatly reduce the cost. X-ray diffraction(XRD), scanning electron microscopy(SEM) and EDAX are used to analyze the structure, morphology of the surface and cross-section and element components. The results show that the coating obtained in acid bath is of microcrystal structure, belonging to medium phosphorous coating; and the coating obtained in alkaline bath is of crystal structure, belonging to low phosphorous coating.
出处
《电镀与环保》
CAS
CSCD
2005年第1期21-23,共3页
Electroplating & Pollution Control
基金
哈尔滨工业大学跨学科交叉性研究基金资助 (HIT .MD .2 0 0 2 .17)
关键词
碳化硅增强铝基复合材料
化学镀
前处理
silicon carbide/aluminum composite materials
electroless Ni plating
pretreatment
