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微机控制钎焊Cu/Al焊接接头的组织与性能 被引量:2

Microstructure and Properties of Cu/Al Brazing Welding Based on Microcomputer Control
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摘要 采用微机控制固定间隙超声波辅助汽车零部件焊接中Cu/Al异质金属的钎焊工艺,在钎焊温度为380、420和460℃时制备Cu/Zn-3Al/Al钎焊接头,观察了不同温度超声钎焊时接头的显微组织与力学性能变化。结果表明,当钎焊温度为380℃时,钎缝层由Zn-Al共晶、α-Al树枝状晶和CuZn5相组成;当钎焊温度为420和460℃时,发现钎缝层由α-Al树枝晶、CuZn5相和Al4.2Cu3.2Zn0.7相组成;在钎焊温度为420℃时,金属间化合物层厚度为1.9μm,扩散层厚度为1.3μm,整个界面层厚度为3种钎焊温度下的最低值,此时钎焊接头的抗拉强度最大。 By brazing technology of Cu/Al heterogeneous metal with fixed gap ultrasonic assisted based on microcomputer control,the change of microstructure and mechanical properties of the Cu/Zn-3Al/Al joint prepare were observed with the ultrasonic soldering temperature at 380℃,420℃and 460℃.The results show that at 380 ℃,brazing layer is composed of Zn-Al eutectic,α-Al dendrites and CuZn5 phases while the brazing temperature is 420 ℃ and 460 ℃,brazing layer is composed ofα-Al dendrites,CuZn5 phase and Al4.2Cu3.2Zn0.7phase.In addition,at 420 ℃,intermetallic compound layer thickness reaches 1.9μm with diffusion layer thickness of 1.3μm,where the interface layer thickness is the minimum value for the three brazing temperature,and the tensile strength of the joint reaches maximum value.
出处 《特种铸造及有色合金》 CAS CSCD 北大核心 2015年第10期1033-1036,共4页 Special Casting & Nonferrous Alloys
关键词 微机控制 钎焊 CU/AL 组织 力学性能 Computer Control Brazing Cu/Al Microstructure Mechanical Properties
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  • 1陈辉,信昕,任玉平,郝士明,李洪晓.Al-Zn-Cu系200℃低铜侧的相平衡[J].中国有色金属学报,2004,14(6):912-916. 被引量:2
  • 2樊艳丽,张柯柯,王双其,程光辉,王要利,余阳春.水洗钎剂下SnAgCu系钎料对不同基板的润湿特性[J].特种铸造及有色合金,2006,26(9):604-606. 被引量:11
  • 3蒋力培 焦向东.球罐高效自动焊关键技术研究[J].高效化焊接国际论坛,2002,11:78-78. 被引量:2
  • 4FOLEY J C, GICKLER A, LEPREVOST F H. Analysis of ring and plug shear strengths for comparison of lead-free solders[J]. Electronic Materials,2000, 29(10) :1258-1263. 被引量:1
  • 5WEI C L, KAO C ,KAO R, Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish[A]. Proceedings and Packaging [C]. Kaohsiung Taiwan, 2002: 330-334. 被引量:1
  • 6MA X,WANG F J, QIAN Y Y. Development of Cu-Sn intermetallic compound at Pb-free solder/Cu joint interface [J]. Materials Leters,2000,57:3361-3365. 被引量:1
  • 7SHAWKRET A, MEI S, LE L. Effects of static thermal aging and thermal cycling on the microstructure and shear strength of Sn3. SAg0.7Cu/solder joints [J]. Journal of Materials Research, 2001, 16(10):2914-2921. 被引量:1
  • 8ZURUZI A S, CHIU C H, LAHIRI S K. Roughness evolution of Cu6 Sn5 intermetallic during soldering[J]. Applied Physics, 1999,86 (9) :4916-4921. 被引量:1
  • 9Watanabe T,Nakamura M,Konuma S,et al. Soldering of aluminum alloy 6063 to copper with ultrasonic vibration [J]. Journal of Japan Institute of Light Metals,2003,53 (6) :245-250. 被引量:1
  • 10Naka M,Hafez K M. Applying of ultrasonic waves on brazing of alumina to copper using Zn-Al filler alloy[J]. Journal of Materials Science. 2003,38 : 3491-3494. 被引量:1

共引文献48

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  • 1LEE W B, BANG K S? JUNG S B, et al. Effects of intermetalliccompound on the electrical and mechanical properties of frictionwelded Cu/Al bimetallic joints during anncaling[J], Journal of Al-loys and Compounds* 2011, 390(6) : 212-219. 被引量:1
  • 2MAHENDRAN G, BALASUBRAMANIAN V’SENTHILVELANT. Developing diffusion bonding windows for joining TiAl /40Cralloys[J], The International Journal of Advanced ManufacturingTechnology, 2009, 42(7-8):689-695. 被引量:1
  • 3宁礼奎.四种镍基高温合金的抗热腐蚀性能研究[D].辽宁大连:大连理工大学,2010. 被引量:1
  • 4元哲石,徐立新,吴执中.Ni+ Cu为中间层的TC4与ZQSnlO-lO的扩散连接试验分析[J].焊接学报,2012,46(3):56-63. 被引量:1
  • 5HIRANO T. Reliability of lead free solder joint by using chip sizepackage[J]. IEEE International Symposium on Electronics andthe Environment* 2012 , 31(5): 285-289. 被引量:1
  • 6宋敏霞,赵熹华,郭伟.Ti-6Al-4V/Ni/ZQSnl0-10的扩散连接[J].吉林大学学报(工学版),2012,36(7):67-73. 被引量:1
  • 7刘旭庆,周峰,梁永民.季膦盐离子液体对钢/锡青铜的摩擦磨损性能研究[J].摩擦学学报,2011,47(7):8卜87. 被引量:1
  • 8许天旱,王党会.Sn-Ag-Cu无铅钎料粉末与合金的组织及钎焊性能对比[J].特种铸造及有色合金,2009,29(10):969-972. 被引量:3
  • 9张权明,刘红斌,谢红.铬青铜与不锈钢瞬间液相扩散焊接界面行为[J].材料科学与工艺,2009,17(5):696-700. 被引量:4
  • 10张青科,邹鹤飞,张哲峰.SnBi/Cu界面Bi偏聚机制与时效脆性抑制[J].中国科学:技术科学,2012,42(1):13-21. 被引量:8

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