摘要
采用扫描电镜 (SEM )、电子探针 (EPMA)、显微硬度等测试方法对Cu/Al扩散焊工艺以及接头的组织性能进行了分析。试验结果表明 :采用真空扩散焊工艺 ,在加热温度 ( 5 2 0～ 5 40 )℃、保温时间 6 0min、压力 11.5MPa时 ,在Cu/Al界面处形成明显的宽度约 40 μm的扩散过渡区。由于在铜侧过渡区中产生金属间化合物 (Cu3Al)会出现硬度峰值。控制Al的扩散含量不超过 10 % 。
s Vacuum diffusion welding procedure and microstructure performance of diffusion joint were researched by means of various test methods, such as micro-hardness test, SEM, EPMA and so on. The test results indicated that under the condition of heating temperature 520～540℃, holding time 60 min and pressure force 11.5MPa, diffusion interface was produced between copper and aluminum. The width of the diffusion transition zone was about 40 μm. The micro-hardness peak zone was formed in the copper side of the interface because of inter-metallic compounds (Cu 3Al). By controlling the Al diffusion content less than 10%, the brittle inter-metallic compounds could be avoided or decreased.$$$$
出处
《焊接》
2001年第10期7-10,共4页
Welding & Joining
关键词
铜/铝
真空扩散焊
显微组织
结合界面
copper/aluminum, vacuum diffusion welding, microstructure
