摘要
采用锻接扩散焊法进行了T2铜/2A50铝合金异种材料的焊接。利用显微硬度、能谱分析(EDS)、扫描电镜(SEM)、X射线衍射(XRD)等测试方法对接头界面附近的显微组织进行分析。试验结果表明,T2铜/2A50铝合金.采用先锻接。后加热到515～525℃之间。保温180min,并在加热和保温过程中通过特殊的夹具提供给试样压力.能得到冶金结合的T2铜/2A50铝合金接头。接头界面处出现了明显的焊缝。
T2 Cu/2A50 Al alloy was bonded by blacksmith diffusion welding technology. The microstructure was researched by means of microhardness test ,SEM, EDS, XRD and so on. The test results indicate that T2 Cu/2A50 Al alloy must first be done by blacksmith welding, and then heated between 515℃ and 525℃ for 180 min, the sample pressure is offered by heating and insulation in the process through special fixture, the joints of T2Cu/2A50Al alloy with metallurgy bond can be obtained, and there is obvious welding seam in the interface.
出处
《热加工工艺》
CSCD
北大核心
2007年第19期36-38,共3页
Hot Working Technology
关键词
铜
铝合金
锻接扩散焊
接头
显微组织
copper
aluminum alloy
blacksmith diffusion welding
joint
microstructure
