摘要
采用真空扩散连接工艺,对Al2O3弥散强化铜/纯铜的连接进行了试验研究。用扫描电镜分析了Al2O3弥散强化铜/纯铜扩散界面组织结构,研究了工艺参数对界面结合状态和组织结构的影响。通过正交试验得出各因素对接头抗拉强度的影响大小依次为:扩散温度>压力>保温时间。正交试验结果表明:焊接温度为550℃,保温时间为3 h,压力为25 MPa时,可获得组织均匀致密、界面连续的Al2O3弥散铜/纯铜扩散焊接头,且接头抗拉强度高达116.9 MPa。
Al2O3 dispersion,strengthen copper and copper were bonded together by vacuum diffusion welding technology.The microstructure feature of the joints interface were investigated by scanning electron microscope.The influence of diffusion welding parameters on interface combining state and microstructure of Al2O3 dispersion,strengthen copper/copper interface were studied.Through orthogonal experiment,the effect order of three factors was as follows:diffusion temperature>pressure>holding time.The experiment results showed that when diffusion temperature was 550 ℃,holding time was 3 h,pressure was 25 MPa,the joint of Al2O3 dispersion,strengthen copper/copper was compact structure and the interface was continuous.The tensile strength of joint was up to 116.9 MPa.
出处
《焊接技术》
北大核心
2012年第1期28-31,2,共4页
Welding Technology
基金
江苏省高校优势学科建设工程资助项目
关键词
Al2O3弥散铜
纯铜
真空扩散焊
正交试验
Al2O3 dispersion,strengthen copper,copper,vacuum diffusion welding,orthogonal experiment
