摘要
借助纳米压痕方法,基于压痕做功和压痕蠕变的原理,对SnAgCuBi-xNi/Cu(x=0,0.05,0.1,0.15,0.2)低银焊点的塑性和抗蠕变性能进行了研究.结果表明,在SnAgCuBi-xNi/Cu焊点中,Ni元素含量为0.05%和1%,焊点的硬度和塑性提高,抗蠕变性能变化不明显,Ni元素含量为0.15%和0.2%,焊点的硬度和抗蠕变性能提高,但焊点塑性下降.Ni元素的添加有利于提高SnAgCuBi/Cu焊点的高温稳定性.在150℃下经400 h老化,焊点的抗蠕变性能随着Ni元素含量的增加而增强,含镍焊点的硬度均高于SnAgCuBi/Cu焊点,Ni元素含量为0.1%的焊点塑性最好.
In order to study the effect of Ni on plasticity and creep performance of low-Ag SnAgCuBi-xNi / Cu( x = 0,0.05,0. 1,0. 15,0. 2) solder joint,the indentation work and indentation creep were measured and analyzed by nanoindentation method. The results show that adding Ni could improve the hardness of solder joint. Adding amounts of 0. 05% and 0. 1% Ni is helpful to improve the plasticity performance but produce almost no impacts on creep. A further Ni adding amount( 0. 15% and0. 2%) can improve the creep resistance at the expense of plasticity. It is found that Ni can improve high temperature stability of SnAgCuBi / Cu solder joints. The creep resisting performance of the solder joints is improved with Ni element increasing after400 h aging at 150 ℃. The hardness of solder joints is improved with the Ni addition. The plasticity performance of solder joints with 0. 1% Ni content is better than others.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2014年第3期31-34,114,共4页
Transactions of The China Welding Institution
基金
国家自然科学基金资助项目(51174069)
关键词
纳米压痕
塑性
蠕变
硬度
nanoindentation
plasticity
creep
hardness
