摘要
介绍了无铅钎料应用时应该满足的基本要求和Sn-Cu系无铅钎料的国内外研究和应用现状,概述了Sn-Cu系无铅钎料润湿性能、物理性能、力学性能等方面的一些特点,分析探讨了Sn-Cu系无铅钎料存在的不足,详细阐述了添加不同合金元素(如Bi、Ag、Ni、RE等元素)对Sn-Cu系无铅钎料性能的影响规律,并对Sn-Cu系无铅钎料的应用前景和发展方向进行了展望。
The requirements of lead-free solder applied to soldering and the research and application status of Sn-Cu based solder were introduced at home and abroad. The wettability, physical property and mechanical property of Sn-Cu based solder were summarized, and some existing problems about Sn-Cu based solder were also analyzed and discussed briefly. The influence of different elements (including Bi, Ag, Ni, RE, etc. ) on properties of Sn-Cu based solder was reviewed in detail, and at the same time, the perspective of development and application of Sn-Cu solder was previewed constructively.
出处
《焊接》
北大核心
2007年第4期14-18,共5页
Welding & Joining
