摘要
综述了近年来国际上无铅钎料的研发现状,重点介绍了无铅钎料的性能要求。指出研究无铅钎料,不只是简单地提供一种替代品,还需要考虑无铅钎料的力学性能、钎焊性能及焊点可靠性能够与传统的Sn-Pb钎料相近、钎焊设备与工艺尽量改动不大等因素,开展无铅钎料的研究具有十分重要的理论意义和实用价值。详细讨论了Sn-Ag系、Sn-Cu系和Sn-Ag-Cu系等三大系列的无铅钎料,指出无铅化电子组装面临着机遇与挑战,要想在激烈的国际竞争中赢得市场,我国必须重视无铅钎料产品的研究开发与产业化,这同时需要电子企业的全力支持与配合。
Research and development of lead-free solders all over the world was reviewed,performance requirements of lead-free solders were introduced emphatically.As an acceptable substitute for Sn-Pb solder,it has to satisfy not only the mechanical property and wettability,but also the process requirements and the reliability requirements that commonly used traditional Sn-Pb solder possesses,and it is imperative to develop and investigate new lead-free solders with better properties.Sn-Ag series,Sn-Cu series and Sn-Ag-Cu series lead-free solders were discussed in details, there are challenges in lead-free electronic packaging.ln order to win the market in the international competition,China must emphasize the development of lead-free solders,which would encourage the relevant enterprises to have farseeing and cooperate wholly.
出处
《电焊机》
北大核心
2010年第12期1-7,共7页
Electric Welding Machine
关键词
无铅钎料
绿色环保
研究和发展
lead-free solders
green environment-friendly
research and development
