摘要
为研究金属间化合物与无铅焊点力学性能之间的关系,采用纳米压痕法测定了Sn-Cu-Ni焊点中金属间化合物及钎料基体的弹性模量和压痕硬度等力学性能参量.结果表明,Sn-Cu-Ni焊点中(Cu,Ni)6Sn5金属间化合物的弹性模量为113.2 GPa±4.8GPa,压痕硬度为5.59 GPa±0.32 GPa,均与钎料基体有较大差异.并基于Mayo-Nix方法计算得到Sn-Cu-Ni,Sn-Cu-Ni-0.05Ce和Sn-Pb钎料基体的蠕变应变速率敏感指数m分别为0.128 6,0.124 8和0.183 2,蠕变应力指数n分别为7.776 0,8.012 8和5.458 5,表明Sn-Cu-Ni系列抗蠕变性能优于Sn-Pb钎料,且微量Ce元素的添加有利于提高Sn-Cu-Ni焊点的抗蠕变性能.
In order to study the effect of intermetallic compound on mechanical properties of joint,the elastic modulus and hardness of intermetallic compounds were analyzed by nanoindentation method,and the creep strain rate sensitivity of solder matrix was obtained by Mayo-Nix method.From the physical analysis of nanoindentation curves,the elastic modulu of (Cu,Ni)6Sn5 in Sn-Cu-Ni joints is 113.2 GPa±4.8 GPa,while the hardness is 5.59 GPa±0.32 GPa.It is found that intermetallic compounds are the key factors in the reliability of lead-free joints,due to the big contrasts between mechanical properties of intermetallic compounds and solder matrix.The creep strain rate sensitivities of Sn-Cu-Ni,Sn-Cu-Ni-0.05Ce and Sn-Pb solder matrix are 0.1286,0.1248,and 0.1832,and the creep stress exponents are 7.7760,8.0128,and 5.4585,respectively,which indicate the improvement in creep resistance of Sn-Cu-Ni joints due to Ce addition.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2011年第12期59-62,116,共4页
Transactions of The China Welding Institution
基金
江苏高校优势学科建设工程资助项目
江苏省高校"青蓝工程"科技创新团队资助项目
江苏省先进焊接技术重点实验室开放研究基金资助项目(10622011501)
