摘要
随着电子产品的尺寸和重量日趋变小,经典Fourier理论已经不能很好地解决实际问题。为了使理论结果尽可能准确地反映实际情况,需要用到Non-Fourier导热模型。首先,建立了三维多芯片组件的Fourier和Non-Fourier导热模型;其次,采用有限差分方法求解相应模型的传热方程,得到了温度分布和温度响应;最后,使用有限元热分析软件ICEPAK建立了相应的热分析模型并进行计算。实验结果表明,与经典的Fourier模型相比,Non-Fourier模型更加接近实际温度,且温度场进入稳态的时间较长,热耦合的现象也更强。
With the reduction in size and weight of electronic products,classical Fourier theory can′t solve practical prob-lems well. To make the theoretical results close to the fact,Non-Fourier model should be used. Firstly,the Fourier model and the Non-Fourier model for three-dimension multi-chip module（MCM）are built separately. Secondly,finite difference method （FDM） is used to solve the corresponding equation of heat transfer and get distribution and response of temperature. Finally, the relevant thermoanalysis model is built up by finite element analysis software of ICEPAK and calculated. The result shows that the temperature of Non-Fourier model is closer to the practical situation than classical Fourier model. The time is longer for temperature field to enter the stable state,and the thermo-coupled phenomenon is stronger.
出处
《现代电子技术》
2014年第3期117-121,共5页
Modern Electronics Technique
