摘要
随着电子信息产业的快速发展,电子器件和封装材料的散热及综合性能要求越来越高,因此寻求高导热、高性能的复合材料成为电子行业中一个研究趋势。从导热模型、导热机理、如何提高热导率三个方面对电子工业领域中所用高分子复合材料进行了总结。
With the rapid development of electronic information industry, the requirements of thermal and comprehensive performance for electronic components and packaging materials are higher and higher, thus seeking composite materials with high thermal conductivity and high-performance has become a research trends in the electronics industry. Summarize the polymer composites used in electronics industry from three aspects of the thermal conduction model, thermal conduction mechanism, and how to improve the thermal conductivity.
出处
《电子工艺技术》
2014年第1期11-14,36,共5页
Electronics Process Technology
基金
广东省国际合作项目(项目编号:2012B050500010)
关键词
复合材料
导热模型
导热机理
Composite materials
Thermal conduction model
Conduction mechanism
