摘要
磷随着平板电脑、智能手机等消费类电子产品的飞速发展,印制电路HDI板逐渐由一阶向二阶、三阶和多阶等方向发展。任意层HDI作为高阶互连技术的最高境界,其应用已越来越受到追捧。以一种10层任意层HDI板为例,讲述该类板的制作难点及解决方法,重点突出了其制作的控制要点,为同行业生产该类产品提供一定的参考价值。
With the development of tablet computer, intelligent mobile phone and other consumer electronics products, HDI board＇s blind via is developino from one step to two steps, three steps and multi steps. Any-layer HDI technology is the highest of the multi steps interconnect technology, it＇s becoming more and more popular. Tacking a l O-layer Any-layer HDI board as the model to describe the difficulties and solutions of production. Hiohlioht production difficulties control points, guidance to improve the technique in the production of any -layer HDI.
出处
《电子工艺技术》
2013年第5期279-283,共5页
Electronics Process Technology
基金
广东省产学研结合重大专项项目(项目编号:2012A090300007)
