摘要
作为超越摩尔定律发展起来的技术,系统级封装(SIP)由于务实地满足市场的需求而越来越受到重视。文章通过优化化学镀铜工艺和配方,成功实现在高深径比的系统级封装微盲孔(深径比1.5:1~2.0:1,孔径100或150μm)内部镀上连续的种子层铜,并使用我公司的电镀铜镀液通过直流电镀的方法成功填满盲孔。
As a technology developed beyond Moore’s Law,System-in-Package(SIP)has received more and more attention due to its pragmatical satisfying market demands.In this paper,by optimizing the electroless copper plating process and formula,a continuous seed layer of copper was successfully plated in the high-aspect ratio system-in-package micro-blind vias(aspect ratio 1.5:1~2.0:1,aperture 100 or 150μm).The blind holes were then successfully filled by direct current electroplating using our electroplating copper bath.
作者
杨彦章
张坚诚
刘彬云
詹东平
杨防祖
Yang Yanzhang;Zhang Jiancheng;Liu Binyun;Zhan Dongping;Yang Fangzu
出处
《印制电路信息》
2022年第S01期258-264,共7页
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