摘要
目前,酸性镀铜难以满足高端PCB生产需要,在酸性电镀溶液中加入组合添加剂FX-203制备电镀铜层,采用霍尔槽法、电化学、SEM和XRD等研究了该添加剂对镀层质量、镀液性能的影响。结果表明:随着FX-203加入量的增大,镀层光亮区和镀液分散能力先增大后减小。该体系适宜的工艺条件:75 g/L CuSO4.5H2O,180g/L H2SO41,6 mg/L TPS,0.6 mg/L M6,0 mg/L PEG6,0 mg/L Cl-,温度20～40℃,施镀15 min;所得镀层光亮平整,光亮区为1.7～9.2 cm,对应电流密度0.11～12.48 A/dm2,镀液分散能力可达到96.1%,深镀能力L/至少可达5,在1～4 A/dm2下电流效率接近100%;FX-203组合添加剂使Cu阴极峰电位负移80 mV,峰电流密度由43mA/cm2降至30 mA/cm2;镀层光滑平整、结晶细小均匀,为面心立方Cu,且沿(111)晶面择优取向;镀层附着力达到GB 5270-85要求;镀层腐蚀速率为42 mg/(dm2.h),耐腐蚀性能良好。FX-203组合添加剂比同类商品添加剂光亮区、发红区、耐高温性能、分散能力及深镀能力更优,适合于PCB酸性镀铜生产。
Electroplated Cu coating was prepared by introducing a combinatory additive FX-203 into an acidic plating bath.The effect of the combinatory additive on the quality of coating and property of plating bath was investigated based on Hull cell test and electrochemical test as well as scanning electron microscopic and X-ray diffraction analysis.Results indicate that the bright area and throwing power of the bath increase initially and decrease later with increasing concentration of the additive.The optimized plating bath consisted of 75g/L CuSO4·5H2O,180g/L H2SO4,16mg/L toughened polystyrene TPS,0.6mg/L methanol(M),60mg/L polyethylene glycol(PEG)and 60 mg/L Cl-,while the optimized temperature and plating duration were 20～40℃ and 15 min.Resultant Cu coating was smooth and bright with a bright area of 1.7～9.2 cm and current density of 0.11～12.48 A/dm2,consisting of evenly distributed fine grains.The plating bath had a throwing power of96.1%,deep-plating ability of over 5 and current efficiency under1～4A/dm2 of about 100%.Meanwhile,the combinatory additive was able to cause negative shift of cathodic peak potential by 80 mV and decrease the peak current density from 43 mA/cm2 to 30mA/cm2.As-plated Cu coating consisted of face centered cubic Cu and preferentially oriented along the (111) crystal face.The adhesion force of the coating was in accordance with Chinese standard GB 5270-85,and it had good corrosion resistance as well.In general,FX-203 additive is superior to similar commercial additives and is suitable for industrial Cu electroplating in acidic hath.
出处
《材料保护》
CAS
CSCD
北大核心
2011年第7期30-34,7,共5页
Materials Protection
基金
国家青年自然科学基金(50904023)
河南省教育厅自然科学研究基金(2010B450001)
河南科技大学青年科学基金(2009QN0022)资助
关键词
酸性电镀铜
印刷线路板
组合添加剂
镀液性能
镀层性能
acidic copper electroplating
printed circuit boards
combinatory additive
property of bath
property of coating
