摘要
通过在Bi-2．6Ag-5Sb钎料合金中添加微量元素sn来改善Bi-2．6Ag-5Sb合金的润湿性和焊接可靠性。研究结果表明：Bi-2．6Ag．5Sb钎料舍金中添加质量分数0．5％～3．0％的sn，随着sn含量的增加，钎料的熔点呈下降趋势，熔点仍然在260-280℃，能明显改善其润湿性和焊接可靠性。
Sn was added into Bi-2.6Ag-5Sb solder alloy in order to improve the wettability and soldering reliability. The results show the wettability and soldering reliability of Bi-2.6Ag-5Sb solder alloy are improved remarkably with the addition of Sn（mass fraction 0.5% - 3.0%）, although the melting point decreases with the adding amount of Sn, the melting point still ranges from 260℃ to 280℃.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2013年第7期60-64,共5页
Electronic Components And Materials
基金
教育部高等学校博士学科点专项基金资助项目(No.20124420110007)
关键词
高温无铅钎料
熔点
润湿性
剪切强度
显微组织
IMC
high temperature lead-free solder
melting point
wettability
shear strength
microstructure
IMC
