摘要
为了防止铅(Pb)对自然环境的污染,目前人们对Sn基无铅钎料及其相关性能作了大量研究.综述了通过改变添加的合金元素种类、温度和Cu基板上的金属镀层,Sn基钎料润湿力以及界面组织形态的变化,提出了在不同实验条件下Sn基钎料的反应润湿性能不同的观点.
In order to prevent lead from polluting the natural environment, the research work on lead-free Sn-based solder and its related performance has been carried out extensively at present. This article is devoted to clarifying the mechanism of reactive wetting and summarizing the change of wetting force of Sn-based solder and the morphology of the interfacial structure by changing the type of alloying elements added to the solder,experimental temperature and metal coating on Cu substrate. A viewpoint that per-formance of reactive wetting of Sn-based solder would vary with different experimental conditions was presented.
出处
《上海工程技术大学学报》
CAS
2009年第3期277-281,共5页
Journal of Shanghai University of Engineering Science
基金
上海市教委第五期重点学科建设资助项目(J51402)
关键词
Sn基钎料
反应润湿
润湿力
合金元素
金属镀层
Sn-based solder
reactive wetting
wetting force
alloying elements
metal coating
