摘要
基于环保的压力和人类健康的需求,电子产品微连接材料采用无铅钎料代替传统含铅钎料已是必然趋势。总结了新型无铅高温钎料的基本要求,重点评述了Bi基合金、Au基合金、Zn基合金和Sn-Sb基合金等几类钎料国内外研究现状,指出通过多元合金相图计算、合金化、材料复合化的方式开发成本、工艺性能均能与含铅钎料相媲美的无铅高温钎料。
Based on the requirement of environmental protection and human health, lead-free solder used elec- tronic products instead of the traditional leaded solder was inevitable trend. This paper summarized the basic re quirements of new high-temperature lead-free solder. Several kind of solder research status at home and abroad about Bi alloy, Au alloy, Zn alloy and Sn-Sb alloy and so on, were reviewed. Developing high-temperature lead- free solder with cost and performance comparable to lead solder by the way of the multi component phase dia gram calculation, alloying and composite method.
出处
《功能材料》
EI
CAS
CSCD
北大核心
2013年第B06期28-35,40,共9页
Journal of Functional Materials
基金
重庆高校优秀成果转化重大资助项目(KJZH11215)
重庆理工大学科研启动基金资助项目(2012ZD12)
关键词
高温钎料
评述
电子微连接
合金化
high-temperature solder
review
electronic micro-connection
alloying
