摘要
以一款16层的叠孔三阶HDI板的制作为例,讲述该类产品的制作难点、控制重点和注意事项等,为同行技术工作者制作该类产品提供参考。
Taking a 16 layer of 3-stacked via HDI board production as an example, this paper describes the production difficulties, key control points and matters requiring attention for the peer and technical workers. It is hoped to provide certain reference for production of the products.
出处
《印制电路信息》
2013年第2期35-38,共4页
Printed Circuit Information
关键词
盲孔
叠孔设计
三阶HDI
激光
电镀填孔
Blind Hole
Stack Via
3-Stack Via
Laser-Drilling
Plating Filling
