摘要
随着目前电子产品不断朝小型化、轻便化、多功能化的方向发展,高密度互连HDI印制板势必会广泛应用于各种电子产品。文章主要介绍了一种叠孔制作时各个细节控制方法及薄板采用垂直电镀工艺进行填孔电镀的可行性。
With the advent of miniaturization, potable, multifunctional of electrical products, HDI will be applied to different electrical products universally. This paper makes a brief description of HDI manufacturing engineer technology and a detailed description of manufacturing engineer technology for six layers HDI boards with stacked via holes.
出处
《印制电路信息》
2013年第S1期282-289,共8页
Printed Circuit Information
关键词
高密度互连
薄板电镀
叠孔
电镀填孔
可靠性
High Density Interconnect(HDI)
Electrolytic Plating Thin Board
Stacked Holes
Electrolytic Plating Filled Hole
Reliability
