摘要
随着线路的精细化发展,PCB布线密度越来越高,部分BGA板已取消通孔与焊球间的引线设计,为此须将BGA焊点与通孔重叠即制作成盘中孔工艺,以满足更高密度的布线需求。传统的盘中孔制作大多采用油墨或树脂塞孔再沉铜电镀的工艺生产,此工艺总是面临塞孔不饱满/黑孔/结合力不足等缺陷,给后续焊接带来极大的品质隐患。本文主要针对盘中孔黑孔及结合力不足进行了验证分析,并通过工艺优化进行了有效改善,大大提高了生产品质及一次性良率。
With the fine development of conductor trace line, the routing density of the PCB has become higher and higher, Part of the PCB with BGA have canceled the design of the lead wire between through holes and solder balls, so, in order to meet the demand of higher-density routing, the BGA solder joints have to overlap with the through hole, which requires to made of holes in pad technology. Most traditional processes of holes in pad technology take ink or resin to plug holes, then, PTH and electroplate, and by this means, the process has always faced many flaws such as not fully plug holes, the black whole, not enough binding force , which will bring enormous hidden danger to the latter part of the welding. The article analyzed and discussed the reasons for the black hole and not enough binding force, and effectively improved these flaws by optimizing the process, then, greatly improved the quality of the production and one-time yield.
出处
《印制电路信息》
2010年第S1期107-110,共4页
Printed Circuit Information
关键词
盘中孔
镀孔菲林
电镀填孔
Holes in pad
Holes plating film
Pore filling plating
