摘要
高布线密度线路板是电子产品的重要组成部分,孔内无沉积铜层是带盲孔的高密度互连线路板可靠性失效的最常见问题之一,主要针对线路板盲孔孔内无铜层弊病原因进行分析和研究,从线路板的生产实践中,摸索并总结出了相应的改善对策和控制方法,以达到保证印制线路板产品品质和提升良品率之目的。
The high density interconnect （HDI） board is the main component of electronic products. And the problem of no copper depostion in the blind hole is one of the most common types of reliability failure in HDI board. In this paper, the cause of blind hole without copper was analyzed and investigated, and the corresponding improve measurements and controlling methods were explored and summerized based on the practise of board manufacturing. Finally, the quality and yield rate of printed circuit board were obtained.
出处
《电镀与精饰》
CAS
北大核心
2012年第10期23-26,34,共4页
Plating & Finishing
关键词
高密度线路板
盲孔沉积铜层
失效
可靠性
high density interconnect board
blind hole
failure
reliability
