摘要
结合行业发展趋势以及在PCB加工过程中的实战经验,通过分析通盲孔固有矛盾以及电镀原理分析,对高厚径比的通盲孔同时并存的产品从溶液交换机理分析加工难度,从而探寻解决同时加工通盲孔问题之道。
This article simply introduces the trend development of via and blind hole design in PCB industry, and illustrates practice experience in the PCB manufacture process. The article introduces the plating mechanism and analyzes the solution exchange contradictory between via and blind hole. The difficulty of solution exchange is pointed out in the high aspect ratio PCB including both via and blind hole. The resolve method to produce via and blind produce at the same time is discussed
出处
《印制电路信息》
2015年第5期25-30,共6页
Printed Circuit Information
关键词
高厚径比
通孔
盲孔
电镀
High Aspect Ratio
Via Hole
Blind Hole
Plating
