摘要
主要阐述了硅片表面沾污测试技术中的一些重要研究进展,同时介绍了几种常见的硅片清洗方法,并对各方法的优点及适用性进行介绍。
This paper mainly expounds the significant developing of the contamination analysis tech- nology on the wafer surface. And it detailed introduces some important wafer clean laaethod and analyzes their advantage and applicability.
出处
《微处理机》
2012年第3期7-10,16,共5页
Microprocessors
关键词
硅片
缺陷检测
湿法清洗
污染物
兆声波
Wafer
Defect detection
Wet - clean
Contamination
Megasonic
