摘要
超声波清洗在硅片生产中具有广泛的应用,影响超声波清洗效果的因素有很多,如清洗液温度、清洗液浓度等。为了研究清洗温度和清洗液浓度对硅研磨片清洗效果的影响,在实验中通过改变清洗液温度及清洗液的浓度,最后观察硅片表面洁净情况。得出清洗液温度和清洗液浓度不是越高越好,在某一具体工艺下,都存在一个适宜范围,在适宜范围内,硅片的清洗效果相对较好,同时研究了清洗时间对硅研磨片清洗效果的影响。
Unltrasonic cleaning of silicon in the production has a broad application,there are many facts of effecting for the effect of unltrasonic cleaning,for example,the cleaning liquid temperature and concentration and so on.In order to study the cleaning solution temperature and concentration on cleaning effect,This experiment by changing the temperature of the cleaning fluid and cleaning solution concentration,we observed the surface of a silicon wafer cleaning.Finally found the temperature of the cleaning fluid and cleaning liquid concentration is not more high and more well,in a specific process,both in the presence of an appropriate range,in a proper range of silicon wafer cleaning effect is relatively good,moreover this article also studied the cleaning time on grinding silicon wafer cleaning effect.
出处
《电子工业专用设备》
2011年第7期23-27,共5页
Equipment for Electronic Products Manufacturing
关键词
硅片
超声波清洗
清洗液温度
清洗液浓度
清洗时间
silicon wafer.unltrasonic cleaning.the temperature of cleaning liquid.The concentration of cleaning liquid.cleaning time
