摘要
合成了改良型Karstedt催化剂,考察了催化剂用量对有机硅灌封胶的固化时间、交联密度、电性能和拉伸性能的影响。结果表明:当催化剂用量为20 ppm时,有机硅灌封胶固化良好,其电性能和拉伸性能较佳。
An improved Karstedt catalyst was synthesized, and the ettects ot catalyst amount on the curing time, crosslinking density, electrical properties and tensile property of the organosilicon encapsulant were studied. The results show that when the catalyst amount is 20ppm, the organosilicon encapsulant is well cured and shows excellent electrical properties and tensile property.
出处
《绝缘材料》
CAS
北大核心
2012年第1期5-7,共3页
Insulating Materials
基金
中国工程物理研究院科学技术基金重要项目(2009A0302018)
关键词
铂催化剂
硅氢加成反应
有机硅灌封胶
交联密度
电性能
拉伸强度
platinum catalyst
hydrosilylation reaction
organosilicon encapsulant
crosslinking density
electrical properties
tensile strength
