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运用加成型有机硅解决导热方面问题研究

Solution of Heat Conduction Problems by Additive Molded Silicone
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摘要 随着我国社会经济的发展,科学技术的进步,电子产品的日益增多,人们对电子产品的依赖性越来越强,工作和生活越来越离不开电子设备.技术的进步,电子设备以及电子元器件进一步实现了高性能、高可靠性的小型化的电子产品,工作效率不断提高,因此各个电子产品在工作过程中产生的热量也会逐渐增加.根据调查研究显示,电子产品的工作热度每增加10度,它的使用寿命就会减少一半,可靠性就会减少一半.为增加电子设备的使用寿命,提高电子设备的可靠性,将电子设备的热量能够极快散发成为目前设备安全运行的主要解决的问题.主要针对运用加成型有机硅解决导热方面问题进行研究. With the development of social economy,the progress of science and technology,the increasing number of electronic products,people’s dependence on electronic products is becoming stronger and stronger.Work and life are more and more inseparable from the progress of electronic equipment,technology,electronic equipment and electronic components to further achieve highperformance,high-reliability of small-scale electronic products,work efficiency is constantly improving.The heat generated by these electronic products in the working process will also gradually increase.According to the investigation and research,every 10 degrees increase in the working heat of electronic products,its service life will be reduced by half,and its reliability will be reduced by half.For this reason,it can increase the service life of electronic equipment,improve the reliability of electronic equipment,and radiate the heat of electronic equipment quickly,which has become the main problem to be solved in the safe operation of equipment.In this paper,additive silicone is used to solve the problem of heat conduction.
作者 吴俊楠 Wu Jun-nan
出处 《化工设计通讯》 CAS 2019年第6期141-142,共2页 Chemical Engineering Design Communications
关键词 加成型有机硅 导热问题 解决措施 addition molded silicone heat conduction problem solution measures
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