摘要
软钎焊焊点界面反应是连接金属的最古老的冶金工艺过程。随着倒装芯片(FC)、球栅阵列(BGA)和芯片级封装(CSP)等面封装技术的兴起,近年来Sn基钎料被广泛应用于微电子制造,包括芯片和基板之间的封装互连以及基板与印制电路板之间的组装互连。这就需要系统地研究Sn基钎料焊点界面反应及微观组织。从形态学、热力学和动力学的角度回顾总结了SnPb共晶钎料、高Pb钎料和无Pb钎料与Cu、Ni、Au/Ni/Cu、PdAg焊盘之间的界面反应。
Solder reaction is one of the oldest metallurgical processes for joining metal parts.With the development of surface packaging technology,such as FC,BGA,and CSP,the use of solder in modern microelectronic technology,that is in connecting the lead frame of a chip to a substrate and in joining the substrate to a print circuit board,is ubiquitous.For the success of the technology,it requires a systematic study of solder reaction.Reviewed solder reactions between one of the several types of Sn-based solders and one of the four pads,Cu,Ni,Au/Ni/Cu,and PdAg,on the basis of the available data of morphology,thermodynamics,and kinetics.
出处
《电子工艺技术》
2011年第6期321-325,329,共6页
Electronics Process Technology
基金
国家自然科学基金资助项目(项目编号:51005055)
关键词
界面反应
微观组织
Sn基钎料
金属间化合物
Solder reaction
Microstructure
Sn-based solder
Intermetallic compounds
