摘要
随着面封装技术的持续发展,古老的软钎焊技术被赋予新使命,Sn基钎料焊点被广泛用于实现芯片与基板之间以及基板与印制电路板之间的电气互连。目前电子封装与组装焊点的失效成为了影响电子产品可靠性的关键问题。这就需要系统地表征焊点服役条件下Sn基钎料合金的力学行为,并刻画其本构关系。本文从本构模型、寿命预测模型及断裂机制三个角度回顾总结了焊点Sn基钎料合金的力学行为方面的研究结果。
With the development of surface packaging technology, Soldering technology has widely served as a familiar route for interconnection between chips and substrates and for joining of substrates and print circuit boards. By now, the failure of solder joints in electronic packaging and assembly becomes a main problem concerning electronics reliability. Hence, it is necessary to describe mechanical behaviors of Sn-based solder joints and to characterize the constitutive relationship. Reviewed the results about mechanical behaviors of solder joints in terms of constitutive relationship, life prediction model, and fracture mechanisms.
出处
《电子工艺技术》
2013年第2期65-69,共5页
Electronics Process Technology
基金
国家自然科学基金资助项目(项目批准号:51005055)
微系统与微结构制造教育部重点实验室开放基金(项目批准号:HIT.KLOF.2009013)
关键词
Sn基钎料
力学行为
焊点
可靠性
Sn-based solder
Mechanical behaviors
Solder joints
Reliability
