摘要
利用ANSYS有限元热分析软件对光抽运垂直外腔面发射激光器(OPS-VECSEL)内部的热场分布和热矢量分布进行了模拟,对比分析了两种散热结构的散热性能,讨论了抽运光斑的参量和金刚石散热片厚度对器件热特性的影响。模拟分析表明:在抽运功率密度较大时,与单面键合金刚石散热片结构相比,双金刚石散热片结构的OPS-VECSEL温升较低,引起的谐振波长差较小,热量向芯片上下两侧散失有利于器件的散热,并且随着抽运功率密度的增大,双散热片结构的散热优势就越明显;当上部金刚石散热片的厚度为500μm、下部金刚石散热片的厚度在300～500μm时可以实现很好的散热效果。
By using ANSYS finite element software, the internal distribution of heat fields and heat flow vector in an optically pumped semiconductor vertical-external-cavity surface-emitting laser （OPS-VECSEL） was simulated. The heat performance of OPS-VECSEL with two different configurations of heat dissipation was compared. Besides, the effects of parameters of pump spot and thickness of heatspreader on temperature rise of VECSEL were discussed. Simulation and analysis show that the temperature rise of OPS-VECSEL with double diamond heatspreaders is much lower as well as the resonate wavelength difference at larger pump power density, and meanwhile it is beneficial for heat dissipation because the heat transports to the top and bottom side of OPS-VECSEL chip. With pump power density increasing, the superiority of heat dissipation becomes more notable. It is also showed that better heat dissipation will be achieved when the top diamond thickness is 500μm and the bottom diamond thickness is 300-500 μm.
出处
《激光与光电子学进展》
CSCD
北大核心
2011年第9期88-92,共5页
Laser & Optoelectronics Progress
基金
吉林省科技发展计划(20080331
20090555)
教育部新世纪优秀人才支持计划(NCET-07-0122)
教育部博士点基金(20102216110001)
国家自然科学基金(61076039)
长春理工大学科研创新基金(XJJLG-2010-03)资助课题
关键词
激光器
半导体激光器
光抽运
热管理
有限元法
lasers
semiconductor laser
optical pump
thermal management
finite element method
